Overview
RX2 Series Mid Power Picosecond Lasers
RX2 Series mid power picosecond lasers offer high performance, high precision, and robust form factor for
the most demanding industrial as well as scientific applications.
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RX2 Series Mid Power Picosecond Lasers
RX2 Series mid power picosecond lasers offer high performance, high precision, and robust form factor for
the most demanding industrial as well as scientific applications.
Specification
| Models | IR | GRN | UV | |||
|---|---|---|---|---|---|---|
| RX2-1064-60 | RX2-1064-100 | RX2-532-40 | RX2-532-70 | RX2-355-20 | RX2-355-28 | |
| Wavelength | 1064 nm | 532 nm | 355 nm | |||
| Output Power | 60 W | 100 W | 40 W | 70 W | 20 W | 28 W |
| Pulse Width | ~10 ps | ~7 ps | ~7 ps | |||
| Pulse repetition rate | Single shot to 2 MHz (option up to 15 MHz) | |||||
| Pulses to-pulse stability4 | < 1% rms | < 2% rms | ||||
Key Feature
- Wide range of wavelengths: 1064 nm, 532 nm, 355 nm, MWB, MWS, & 266 nm options on request.
- Power : Up to 100 W IR, 70 W GRN, or 28 W UV,.
- High single pulse energy: Up to ~600 µJ single pulse energy IR.
- High repetition rates: Options up to 8 MHz or ~32 MHz.
- Highest efficiency picosecond laser with the lowest powerconsumption:< 700 W typical.
- Excellent TEM00 beam, and Pointing Stability: Typical M2 < 1.2; < 20 μrad.
- Exceptional and Versatile Pulse Control:
-
- PEC (Power or Pulse Energy Control).
- PSO (Position Synchronized Output) mode for external triggering to any arbitrary PRF while maintaining a constant, stable pulse energy with low jitter .
- Burst Mode for individually controllable pulses in burst envelopes of up to 10 pulses with intra-burst pulse separation of ~31 ns.
- POD (Pulse-On-Demand) pulse bursts can be triggered internally, externally, or continuously, while maintaining constant pulse energy.
Applications
- Cutting/Drilling/Scribing Thin Metal/Metal Foil, Ceramic, Glass,Ultra Thin Glass (UTG), Plastic, Glass-reinforced Plastic.
- Flat Panel Display, LCD/LED/OLEDRepair/Microprocessing.
- Ink-Jet Nozzle Hole Drilling, LaserMilling Ink-Jet Nozzle Holes, LaserAblation Ink-Jet Nozzle Holes.
- Brittle Material Microprocessing.
- Medical Stents, Medical Device Laser Microprocessing.
- Low-κ Dielectric Wafers, SiliconWafers, Flexible Printed Circuit Boards (FPCB), Printed Circuit Boards (PCB) Microprocessing.
- Hydrophobic Material Manufacturing,Hydrophilic Material Manufacturing, Ultrafast Laser Assisted Etching (ULAE) Systems.
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