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    DC Series

    Photonics Industries’ DC Series Nd:YLF nanosecond lasers are the result of over 30 years of innovation and refinement, starting with the very first laser we built. This groundbreaking product laid the foundation for our patented intracavity harmonic generation technology, which revolutionized the industry with superior harmonic conversion efficiency, exceptional beam quality, and unparalleled beam pointing stability in a compact, simple design.

    Delivering pulse energies up to 1.5 mJ, repetition rates from single shot to 10 kHz, and low pulse widths, all in a lightweight, air-cooled form factor, the DC Series has been perfected to meet the most demanding industrial applications. Its reliability and long-term stability make it a trusted tool for precision manufacturing, embodying our legacy of pioneering laser technology.

    Overview

    Photonics Industries’ DC Series Nd:YLF Nanosecond Lasers combine ideal mJ pulse energy levels with high kHz repetition rates (single shot to 10 kHz), while maintaining short pulse widths, all within a compact, air-cooled form factor.

    Specification

    Specifications – DC Series

    Specifications – DC Series
    DC50-527 DC100-527 DC150-527
    Wavelength 527nm
    Average Power @ 3kHz 1W 2W 3W
    Pulse Energy @ 1kHz ~500µJ ~1mJ ~1.5mJ
    Pulse Width @ 1kHz ~30ns
    Pulse Repetition Rate Single shot to 10 kHz
    Pulse-to-Pulse Stability <3% rms
    Long-Term Power Stability <2% rms
    Beam Spatial Mode & M² TEM₀₀ – M² ≤ 1.2
    Beam Divergence (nominal) < 2 mrad
    Beam Diameter at Exit (nominal) ~ 0.4mm ~0.7mm
    Beam Roundness >85%
    Beam Pointing Stability <25 µrad
    Polarization Ratio Vertical; >100:1
    Operational Specifications and Characteristics
    Interface RS232, Ethernet, Software GUI, External TTL Triggering
    Warm-up Time < 5 minutes from standby, <10 minutes from cold start
    Electrical Requirement 100-240 V AC – 15 V DC, 13.4 A [PSU Included]
    Line Frequency 50-60 Hz
    Power Consumption ~50W ~130W
    Dimensions 8.5 x 4 x 5 in 11 x 5 x 5 in
    Weight ~6 lbs (~2.7 kg) ~15.5 lbs (~7 kg)
    Environmental Requirements
    Ambient Temperature 15°C to 30°C (59°F to 86°F) Operating Range
    Relative Humidity 0% to 80% max, non-condensing
    Storage Conditions -10°C to 40°C, sea level to 12000 m
    Cooling System Air-Cooled

     

    DC50-351 DC100-351 DC150-351
    Wavelength 351nm 351nm 351nm
    Average Power @ 3kHz 0.5W 1W 1.5W
    Pulse Energy @ 1kHz ~250µJ ~500µJ ~1mJ
    Pulse Width @ 1kHz ~30ns ~30ns ~30ns
    Pulse repetition rate Single shot to 10 kHz
    Pulse-to-pulse stability1 <3% rms
    Long-term power stability2 <2% rms
    Beam spatial mode & M2 TEM00 – M2 ≤ 1.1
    Beam divergence (nominal) < 2 mrad
    Beam diameter at exit (nominal) ~ 0.4mm ~ 0.4mm ~ 0.5mm
    Beam roundness >85%
    Beam pointing stability <25 µrad
    Polarization ratio Horizontal; >100:1
    Operational Specifications and Characteristics
    Interface RS232, Ethernet, Software GUI, External TTL Triggering
    Warm-up time < 5 minutes from standby, <10 minutes from cold start
    Electrical requirement 100-240 V AC – 15 V DC, 13.4 A [PSU Included]
    Line frequency 50-60 Hz
    Power consumption ~50W ~50W ~130W
    Dimensions 8.5 x 4 x 5 in 8.5 x 4 x 5 in 11 x 5 x 5 in
    Weight ~6 lbs [~2.7 kg] ~6 lbs [~2.7 kg] ~15.5 lbs [~7 kg]
    Environmental Requirements
    Ambient temperature Ambient 15°C to 30°C (59°F to 86°F) Operating Range
    Relative humidity 0% to 80% max, non-condensing
    Storage conditions -10°C to 40°C; sea level to 12000 m
    Cooling system3 Air-Cooled

    Key Feature

    • Up to ~1.5mJ Pulse Energy at 1 kHz .
    • True TEM00 Output .
    • Short Pulse Widths .
    • Air-cooled with Radiator Cooled Option .
    • Robust & Compact Form Factor .
    • Dynamic Pulse Energy Control – PEC .
    • Position Synchronized Output – PSO .
    • Power Monitoring and Self-Calibration .

    Applications

    • Laser Cutting, drilling, welding, and marking .
    • Flat panel display repair (LCD/LED/OLED) and laser-assisted chemical vapor deposition (LACVD).
    • Flexible printed circuit boards (FPCB), printed circuit boards (PCB), and liquid crystal polymer (LCP) microprocessing. 
    • Stereolithography (SLA), rapid prototyping 3D printing systems, and UV laser 3D printing. 
    • Mass spectrometry and MALDI systems.

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