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Wafer Level CIS Optotronical Parameter Tester

SG-O is a CIS / ALS / Light-Sensor wafer tester which combines a Highly Uniform Light Source and a Semi-Automatic Wafer Prober. The Highly Uniform Light Source can provide a continuous white light spectrum from 400nm to 1700nm with the monochromatic light output with certain FWHM at many different wavelength. The Prober can handle max. 200mm wafer size and single die of size greater than 1cm x 1cm. SG-O integrates a ultra-low noise thermal chuck which can provide the temperature range from -60°C to 180 °C with rapid temperature ramping speed and stability. SG-O provides all you need in CIS / ALS / Light-Sensor design validation or process-yield checking.

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Overview

SG-O is a CIS / ALS / Light-Sensor wafer tester which combines a Highly Uniform Light Source and a Semi-Automatic Wafer Prober. The Highly Uniform Light Source can provide a continuous white light spectrum from 400nm to 1700nm with the monochromatic light output with certain FWHM at many different wavelength. The Prober can handle max. 200mm wafer size and single die of size greater than 1cm x 1cm. SG-O integrates a ultra-low noise thermal chuck which can provide the temperature range from -60°C to 180 °C with rapid temperature ramping speed and stability. SG-O provides all you need in CIS / ALS / Light-Sensor design validation or process-yield checking.

Key Features

Highly Uniform Light Source

  • Wide Spectral Range from UV to SWIR.
  • Highly Uniformity Better Than 98% Over 50mm x 50mm Area.
  • Ultra-Stable Light Intensity In-stability < 0.2% over 10hrs.
  • High Light Intensity Dynamic Range, up to 140d.

Highly Uniform Light Source

  • Wide Spectral Range from UV to SWIR.
  • Highly Uniformity Better Than 98% Over 50mm x 50mm Area.
  • Ultra-Stable Light Intensity In-stability < 0.2% over 10hrs.
  • High Light Intensity Dynamic Range, up to 140dB.

Wide Temperature andLow Noise Chuck

  • Modular Chucks.
  • Wide Range of Temperature from -80°C to 180°C.
  • Advanced CDA Thermal Control Technology, High Ramping Rate and High T Stability.
  • Ultra-Low Noise for Accurate CIS / ALS / Light-Senser Wafer Testing.

Specification

  • Spectral Range: 400nm to 1700nm.
  • Color Contrast Temperature: 3000K to 5200K.
  • Area of Uniform Illumination: 42mm x 25mm at >200mm working distance.
  • Uniformity of Illumination: better than 98%.
  • Short Term Light Instability: ≤ 1% over 1hr.
  • Long Term Light Instability: ≤ 1% over 10hr.
  • Working Distance between DUT and Last Optical Element is  ≥ 200mm working distance.

Applications

  • CIS/ALS/Light-Sensor Wafer Testing.
  • CIS/ALS/Light-Sensor Wafer Mapping and Yield Checking.
  • ToF Sensor Testing.
  • LiDAR Sensor Testing.
  • InGaAs PD testing.
  • SPAD sensor Testing.

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