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    OPTEC LIGHTSHOT LSV3

    Optec LightShot LSV3
    LightShot LSV3 UV Excimer Catheter Processing Workstation

    • Versatile, robust and easy to use, the LightShot V3 (LSV3) makes it possible to bring laser processing in-house and reduce manufacturing costs, without the need for a skilled technician. Optec’s intuitive ProcessPower™ software includes method development functions that facilitate writing recipes for rapid-prototyping, pre-production and full production.
    • The LSV3 is equipped with mask projection optics under PC control for “photolithography precision” ablations that removes insulation, residue and flashing without damaging the metal surface and with sharp transitions from polymer to metal.
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    Overview

    The LightShot V3 (LSV3) is a versatile, robust, and user-friendly laser processing system that enables in-house laser processing, reducing manufacturing costs without requiring a skilled technician. It features Optec’s intuitive ProcessPower™ software, which streamlines method development for rapid prototyping, pre-production, and full production. The LSV3 is equipped with mask projection optics under PC control, delivering photolithography precision ablations that efficiently remove insulation, residue, and flashing without damaging metal surfaces, ensuring sharp transitions from polymer to metal.

    Key Features

    • Deep-UV laser micromachining yields minimal HAZ (heat affected zone) without debris, residue or oxides.
    • No damage to electrode.
    • Flat, uniform beam removes ~ 1/3 um per shot. * Confocal performance – when the part is in the laser beam is in focus for rapid processing with high repeatability.
    • Continuously variable demagnification optics amplify the energy density when more power is needed for challenging materials.
    • User friendly software routines make it easy to develop part processing recipes.
    • Precision ablation depth control down to 100nm per shot (material dependent) and energy density control for removing material layer-by layer.
    • High definition imaging down to 1.5 µm; submicron part positioning resolution and micron level ablation accuracy.
    • Air-cooled, SFF* excimer laser.
    • 248 nm or 193 nm wavelengths.
    • Mask-projection “flat” ablations.
    • Live, zoom video microscope color viewing.
    • Pneumatic rotary chuck with collets.
    • Sub-micron resolution motion control.
    • integrated NEMA 12 gas cabinet.
    • Integrated industrial PC.
    • Auto-focus software function.
    • Fume extraction.
    • Class 1, interlocked, safety enclosure.

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