Features
Designed for Variety of On-Wafer Applications :
- RF measurements up to 67 GHz & 4-port setup.
- Integration of broadband measurements up to 220 GHz.
- Simultaneously for RF, DC-IV / DC-CV / Pulsed-IV measurements.
- High Power applications up to 10 kV/400 A.
Production Reliability :
- Designed for 24/7 production reliability.
- Safety cover with interlocks providing a closed environment.
Ergonomic Design and Options
- Designed with easy single wafer front loading and unloading.
- Large Probe Platen supporting up to 4x RF MicroPositioners or standard 4.5” / 6.5” probe card holder.
- Standard two cassettes for 100, or 150 or 200 mm wafers.
- Available with various ambient or thermal chucks from 20 to 300 °C.
- Wide range of on-axis optics in addition to Standard off-axis wafer alignment camera.
- Optional upper looking chuck camera for probe-to-pad alignment.
- Dedicated thin wafer handling option down to 50 µm.
